TE CONNECTIVITY/AMP BRAND
XFP HEAT SINK CLIP PLATED
“MFG = TE CONNECTIVITY/AMP BRAND, MOQ = 35, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 12 WEEKS”
Item is subject to 20% import tariff.
XFP KIT W/CAGE CLIP HEAT SINK PCI
“MFG = MOLEX, MOQ = 160, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 15 WEEKS”
Item is subject to 20% import tariff.
Rect Assembly with heat sink/l
“MFG = MOLEX, MOQ = 2, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 19 WEEKS”
Item is subject to 20% import tariff.
CXP RCPT KIT W/LIGHT PIPE & HEAT SINK
“MFG = MOLEX, MOQ = 2, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 19 WEEKS”
Item is subject to 20% import tariff.
Heat Sink Clip zQSFP+
“MFG = MOLEX, MOQ = 20, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 4 WEEKS”
Item is subject to 20% import tariff.
HEAT SINK FOR CFP4
“MFG = AMPHENOL FCI, MOQ = 3, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 19 WEEKS”
Item is subject to 20% import tariff.
29MM HEAT SINK ASS Y
“MFG = CUI DEVICES, MOQ = 2, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 10 WEEKS”
XFP KIT W/CAGE CLIP HEAT SINK SAN
“MFG = TE CONNECTIVITY/AMP BRAND, MOQ = 2, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 16 WEEKS”
Item is subject to 20% import tariff.
HEAT SINK SFP DWDM 10.0mm TALL
“MFG = TE CONNECTIVITY/AMP BRAND, MOQ = 5, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 15 WEEKS”
Item is subject to 20% import tariff.
I/O CONNECTORS HEAT SINK CLIP GANGED SFP
“MFG = MOLEX, MOQ = 2040, STOCK SHIPS IN 1-2 DAYS, OUT OF STOCK LEAD-TIME = 15 WEEKS”
Item is subject to 20% import tariff.